Microstructure-controlled stress evolution during Cu6Sn5 growth in Sn/Cu coatings
In this new paper, we model how Cu6Sn5 growth and grain boundary transport control stress evolution in Sn/Cu coatings. The results show that grain boundary diffusion and sliding act as orientation-dependent stress relaxation mechanisms. This explains why non-columnar Sn microstructures can develop much lower compressive stresses and, potentially, a reduced propensity for Sn whisker formation. Out now in Materialia.
